At the beginning of the month, it became known about the release of the Mycro Direct-Die RGB Pro water block from Thermal Grizzly, a popular brand among overclocking enthusiasts. Well-known German blogger Der8auer explained that the addition of controllable RGB backlighting is not the only important difference between the new version of the water block and its predecessor. The company has eliminated important shortcomings that affected the efficiency of processor cooling and the reliability of the system as a whole.
Image source: Thermal Grizzly
Let us remind you that this water block is unique in its own way in that it provides for direct contact of its nickel-plated base with the processor crystal through a thermal interface. To install it, the processor must lose the standard heat spreader cover, and such manipulation not only automatically voids the processor’s warranty, but also carries a certain risk of irreversible damage to the processor itself.
The first revision of this water block was withdrawn from sale due to not the most outstanding cooling performance indicators. In the new version, the water block has a housing design that allows for higher clamping force compared to its predecessor, and this allows for improved heat transfer conditions between the processor crystal and the base of the water block.
When creating a new generation of water block, Thermal Grizzly engineers had to switch from a simple 45-degree chamfer around the perimeter of the CNC machined metal surface to a rounded version, since the sharp edges of early prototypes could, after a couple of dozen repeated removals and installations of the processor, have a destructive mechanical effect on the printing surface. processor board.
Secondly, the contractor for applying the nickel coating to the base of the water block also had to be changed; after a series of experiments, the optimal option was selected, which does not give a special aesthetic effect, but from the point of view of the durability of the coating, provides the desired result. Nickel can be applied to copper either by electrolysis or by chemical methods. In the first case, better thermal conductivity properties are provided, but corrosion resistance suffers. The base of the water block usually comes into contact with a thermal interface of the “liquid metal” type, and it tends to destroy both uncoated copper and aluminum, so the base of the water block must be coated with nickel.
Finally, the distance between the microfins inside the water block, which are washed by the flow of coolant, in the new version was reduced from 0.5 to 0.25 mm, thereby increasing the total area of the cooled surface. The number of ribs increased, and their height had to be reduced to reduce hydrodynamic resistance. Before entering the market, the second revision of the water block was tested by 10 specialists in overclocking and cooling systems. Of course, such a solution for the LGA 1700 processor socket was somewhat late on its way to the market, but in this case, “it’s never too late to learn,” according to Der8auer. Thermal Grizzly, led by this enthusiast, will transfer the experience gained to the development of a similar water block for Arrow Lake processors.