G.Skill has introduced enhanced DDR5 R-DIMM memory modules for workstations and server systems that comply with the latest version of the DDR5 R-DIMM standard from JEDEC. The new modules are manufactured using 16-layer printed circuit boards for improved signal integrity.
Image Source: G.Skill
The manufacturer claims that the new DDR5 R-DIMM modules use an advanced 16-layer PCB, a significant upgrade over previous 8- or 10-layer designs. The increased number of PCB layers improves signal integrity, reliability, and data stability, even under high-performance workloads and overclocked conditions in workstations and servers.
To protect against voltage surges, the new DDR5 R-DIMM modules are equipped with two bidirectional TVS diodes and a fuse, which ensures stable voltage levels and protects the memory from power surges.
The company says the new DDR5 R-DIMM memory modules will be available through G.Skill’s distribution partners worldwide in mid-2025.