Accelsius, a developer of two-phase liquid cooling systems, announced the successful testing of NeuCool technology for GPU heat dissipation up to 4500W. The solution is designed to meet the future cooling needs of data centers for next-generation high-performance AI accelerators.
NeuCool is a two-phase system that uses Direct-To-Chip (DTC) liquid cooling technology. In preparation for the arrival of more powerful accelerators, Accelsius performed two temperature tests using a system that simulates a GPU.
Image source: Accelsius
One of the experiments simulated the operation of the accelerator with a TDP of 4500 W. For comparison: for NVIDIA H100 this figure is up to 700 W. During the tests, the temperature of the cooling plate was said to remain stable and within acceptable limits – even under such unprecedented loads. In other words, Accelsius emphasizes, NeuCool has significant cooling potential to support several future generations of GPUs. The result shown is currently a record for DTC-type liquid cooling systems.
In the second test, Accelsius successfully demonstrated the ability of its dual-phase liquid cooling system (CDU) to support a rack of AI servers with a total power of 250 kW (though this solution is not yet suitable for the 600 kW Rubin Ultra NVL576). The machines used in this experiment were equipped with four NVIDIA H100 accelerators. The cooling plates were in direct contact with key components, including the CPU and GPU. Different modes were tested – with external loop water temperatures of 20, 30 and 40 °C and a flow of 375 l/min. Even with the maximum rack load and an inlet temperature of 40 °C, the GPU temperature remained below the limit (about 87 °C).