On the eve of its own MDDC 2025 conference, MediaTek announced its most powerful mobile chip yet, the Dimensity 9400+, an updated and improved version of the Dimensity 9400 that debuted in the fall. The new product is also intended for flagship smartphones.
Image source: mediatek.com
The MediaTek Dimensity 9400+ chip is manufactured using TSMC’s second-generation 3nm process technology. The powerful Arm Cortex-X925 core now operates at a clock frequency of up to 3.73 GHz (previously 3.62 GHz); three Cortex-X4 cores have a frequency of 3.30 GHz, four Cortex-A720 – 2.4 GHz. The MediaTek NPU 890 artificial intelligence accelerator has increased the operating speed compared to the previous-generation chip: a wide range of large language models is supported, Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP) and FP8 inference with increased reasoning speed. Speculative Decoding+ (SpD+) performance has increased by 20%.
The MediaTek Dimensity 9400+ includes a 12-core Arm Immortalis-G925 graphics processor, which supports transparency micromaps (OMM), providing realistic visual effects; a frame rate converter MFRC 2.0+ has been added, which provides a two-fold increase in frame rates while increasing energy efficiency by up to 40%. The MediaTek Imagiq 1090 signal processor remains in place, allowing you to record HDR video across the entire zoom range; Smooth Zoom technology is designed for smooth shooting of moving objects.
The chip enables direct Bluetooth connections between smartphones at a distance of up to 10 km, which is 6.6 times greater than that of the Dimensity 9400. The MediaTek Dimensity 9400+ chip connects to BeiDou satellites 33% faster even without cellular coverage. It supports tri-band Wi-Fi 7 with five streams; MediaTek Xtra Range 3.0 technology provides Wi-Fi coverage of 30 m. It supports image output at a resolution of 3440 × 1440 pixels; there are three MIPI ports for three-fold displays. It supports Bluetooth 6.0, LPDDR5X 10667 memory up to 10.7 Gbps, UFS 4, and MCQ multi-ring queue. The first smartphones on MediaTek Dimensity 9400+ will hit the market in April. The chip will be used in the Oppo Find X8s and X8s+, Vivo X200s and Realme GT7.