Samsung has announced the launch of mass production of the world’s thinnest LPDDR5X memory modules with capacities of 12 and 16 GB. Their thickness is about 0.65 mm, which is 0.06 mm less than standard solutions. New products will find application in productive mobile devices focused on working with AI.
Image source: news.samsung.com
This result was achieved through the formation of 4-layer modules on an optimized printed circuit board with processing on the back side of the wafer and the use of epoxy molding compound (EMC). This improves air circulation inside the smartphone and optimizes temperature management on the device as a whole – this is important for high-end models. The new 0.65 mm LPDDR5X memory modules are 9% thinner than similar ones, and their thermal resistance is 21.2% higher, Samsung calculated.
It is difficult to say what contribution memory with a thickness of 0.65 instead of the traditional 0.71 mm will have in reducing the thickness of smartphones. Gadget makers are taking different approaches to make them thinner, and they’re obviously willing to welcome optimizations to any component: thinner glass, printed circuit boards, and, of course, batteries. In the case of new memory modules from Samsung, the gain will probably be expressed not in the geometry of the device, but in improved air circulation, which will have a beneficial effect on its performance.
Samsung intends to further improve LPDDR5X components. Next in line are 6-layer modules with a capacity of 24 GB and 8-layer modules with a capacity of 36 GB, although the company has not yet indicated their thickness.