Intel to expand chip packaging capacity in China

Amid delays in the construction of chip manufacturing and packaging facilities in Poland, Intel continues to believe in the potential of the Chinese market, as its local unit announced on WeChat plans to expand chip packaging and testing capacity in Chengdu, China. Along the way, a new customer service center will be built that will help adapt Intel products to the needs of Chinese customers.

Image Source: Intel

Intel’s first chip packaging facility opened in Chengdu back in 2004, and by the end of 2005 it began producing products. By 2007, its second stage was put into operation, which began testing and packaging the latest Intel processors. Now this site is one of the three largest in the company around the world. In particular, the local facility processes up to half of all mobile processors supplied by Intel.

Expansion plans at Intel’s Chengdu facility focus on increasing capacity to test and package server processors. To allow them to be tailored to the needs of specific Chinese customers, a customer service center will be built next to the plant. The company has begun work to prepare for the construction of planned new buildings in Chengdu, confirming the importance of the Chinese market to its business.