Ventiva offers fanless cooling for chips up to 40W TDP

Creating air flow by ionizing its molecules has long been used in household fans, but Ventiva is seriously thinking about introducing similar technology in the field of cooling laptop components. At CES 2025, it plans to demonstrate the ICE9 cooling system for mobile processors with a TDP level of up to 25 W, and in the future its efficiency can be raised to a level that can handle 40 W.

At least, Ventiva and its partners are going to reach this milestone by 2027. Initially, the efficiency of ICE9 did not allow this cooling system to handle processors with a TDP level of more than 15 W, but now progress has been made. A small module with a thickness of only 12 mm allows the formation of air flow due to ionization, it contains no moving parts and does not create noise, but has limited static pressure.

In other words, it is too early for laptop manufacturers to think about abandoning the use of fans in cooling systems, but their number can at least be reduced. Most likely, in practice, in laptops with fairly powerful processors, such a module will most often be combined with low-noise fans. Prototypes of laptops using the ICE9 module may be demonstrated at CES 2025 in Las Vegas, which will be held in the first half of January.