To produce chips using technologies with standards of less than 2 nm, next-generation lithographic scanners with a high numerical aperture (High-NA) and using ultra-hard ultraviolet radiation (EUV) will be required. Samsung Electronics has already received the first sample of such equipment for installation at its flagship plant in Hwaseong.
Image Source: Samsung Electronics
Given that Intel already has at least two of ASML’s lithography scanners in Oregon, and that rival TSMC has also shown cautious interest in such equipment, Samsung’s move could be considered timely. According to South Korean media, the company received the first ASML TwinScan EXE:5000 scanner for use at its Hwaseong facility earlier this month. Samsung will need this class of equipment for experiments in producing chips using technologies thinner than 2 nm.
In the fourth quarter of last year, Samsung, according to TrendForce, occupied 8.1% of the global contract chip manufacturing services market. In just one quarter, the losses amounted to one percentage point, while TSMC strengthened its position by 2.4 percentage points to 67.1%. Samsung’s revenue decreased sequentially by 1.4% to $3.26 billion. Timely development of advanced technological processes will allow Samsung to more effectively maintain its market positions. By 2028, TSMC expects to introduce High-NA EUV class equipment in mass chip production, Intel expects to do this much earlier.