Nvidia, together with leading manufacturers SK Hynix, Samsung and Micron, is developing a new memory standard aimed at high performance and compact dimensions. The standard is called System On Chip Advanced Memory Module (SOCAMM) and is already undergoing testing.
Image source: NVIDIA
Firstly, SOCAMM will be more cost-effective compared to DRAM in the SO-DIMM format, since the technology allows placing LPDDR5X memory directly on the substrate. Secondly, SOCAMM will receive more input/output interfaces – up to 694 ports versus 644 for LPCAMM and 260 for traditional DRAM, which should significantly increase the throughput and data exchange rate.
In addition, since the module is detachable, it will make it easier to upgrade the equipment in the future. At the same time, the compact size will also help to increase the overall memory capacity.
Technical details of SOCAMM are currently being kept under wraps, as the standard is being developed outside of JEDEC. According to available information, Nvidia and partners are currently exchanging prototypes of the module for performance testing.
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