Micron will begin assembling HBM memory in Singapore next year – factory construction has begun

The modest size of Singapore does not prevent this dwarf state from acting not only as one of the largest hubs for the supply of electronic components, but also from producing them in decent quantities on its territory. Micron plans to launch a packaging facility for the HBM family of memory chips here by 2026; construction began this week.

Image source: Micron Technology

At the corresponding solemn ceremony, as DigiTimes notes, a fairly representative delegation of Singaporean officials was present. Micron Technology’s memory chip testing and packaging facility, which was groundbreaking this week, will be the first of its kind in Singapore. It will begin work next year, and a year later Micron intends to significantly expand its capabilities for testing and packaging chips using advanced methods.

By the end of this decade and early next, Micron hopes to invest about $7 billion to expand such facilities, creating 1,400 to 3,000 new jobs. These indicators take into account the company’s need to increase the staff of developers of relevant technologies and components. Micron also intends to expand its NAND solid-state memory production capacity in Singapore. The company will flexibly balance the types of expanded production lines according to market needs.