MediaTek unveils Dimensity 6400 chip for budget smartphones – another reissue of the four-year-old Dimensity 810

MediaTek has officially unveiled the Dimensity 6400 single-chip platform for affordable mid-range smartphones. In fact, the new product is a minor update to last year’s Dimensity 6300 chip, which, in turn, was a minor update to the Dimensity 6080 from 2023. By the way, the latter is very similar to the Dimensity 810, which was released in 2021.

Image source: GSM Arena

The Dimensity 6400 is manufactured using TSMC’s 6nm process technology and has the same eight-core configuration as its predecessor. The chip is equipped with two Cortex-A76 cores with a frequency of up to 2.5 GHz and six Cortex-A55 cores with a frequency of up to 2.0 GHz. An ARM Mali-G57 MC2 accelerator is provided for graphics processing. The chip is designed to work with LPDDR4X RAM with a frequency of up to 2133 MHz and UFS 2.2 storage. Displays with a resolution of Full HD+ are supported. The integrated 5G modem provides a peak data transfer rate of up to 3.3 Gbps. Wi-Fi 5 (802.11ac) and Bluetooth 5.2 are also supported.

Overall, the Dimensity 6400 is an overclocked version of the Dimensity 6300, with the clock speed of the Cortex-A76 cores increased by 0.1 GHz. The changes may also have affected the graphics processor, but the manufacturer did not specify this data. As already noted, the configuration with two Cortex-A76 cores, six Cortex-A55 cores and Mali-G57 MC2 graphics has been used since 2021 – it was presented in the Dimensity 810 chip.

The Dimensity 810 was also manufactured using a 6nm process, but it was less powerful, supported cameras with a resolution of up to 64 MP, and its 5G modem provided data transfer speeds of up to 2.77 Gbps. However, this chip, released four years ago, is very similar in its architecture to the new MediaTek product presented this week.

While the Dimensity 6400 is already aging, it will power new smartphones like the Realme P3x 5G, which will be announced later this week.