Human anatomy suggests promising way to cool chips – they just need a ‘circulatory system’

AI accelerators have quickly increased chip heat output to 500 W and beyond, creating additional challenges for the architecture and heat dissipation system of computing platforms. Classic finned radiators and radiators with straight channels for pumping coolant are no longer up to the task of heat dissipation. Breakthrough solutions are needed, which, surprisingly, can be found in living nature and even in the human body.

Image source: AI generation Grok 3/3DNews

In recent years, the industry has experimented extensively with on-chip microchannel cooling, finding it promising but problematic. By pumping coolant through microchannels in close proximity to the working die, it is possible to actually improve heat dissipation efficiency. This approach also eliminates the need for transition elements between the chip and the cooling system, reducing thermal resistance and increasing the rate of heat dissipation. However, experiments have shown that there are still problems with pressure drop in the coolant distribution system, which leads to hot spots and zones with sharp temperature jumps.

A group of scientists from several companies, including Microsoft, have studied the possibility of creating microchannels in silicon that imitate the hierarchical structure of human blood vessels. As is known, the circulatory system not only nourishes the body, but also participates in thermoregulation. Experiments have shown that a similar approach applied to cooling silicon chips gives excellent results.

Moreover, silicon chips can be designed from the start with a unique structure of “arteries, veins, vessels and capillaries,” which will allow for more efficient cooling of high-heat-generating areas and not overload less loaded areas with the cooling system. This will help balance heat dissipation and increase the reliability of processors.

Scientists have proven that simulating the circulatory system in silicon chips reduces the temperature at the hottest points of the processor by 18 °C, and also reduces the pressure in the cooling system by more than 67%, which reduces the load on the pumps and increases the service life of the system. In addition, a three-fold decrease in the temperature spread between the processor cores was recorded compared to traditional cooling methods.

Based on the data obtained, the researchers concluded that classical CMOS chip manufacturing technology allows for increased computing power while keeping overheating within acceptable limits.