According to the plans of the US authorities, the so-called “Chip Law” of 2022 provides for the allocation of subsidies and preferential loans not only for the construction of enterprises for the production of chips in the country, but also to support research activities. Hewlett-Packard, as Reuters explains, will receive $50 million from the US authorities as part of such an initiative.
Image source: HP Inc.
The HP Research Center in Oregon is already studying microfluidics and microelectromechanical systems; subsidies allocated by the US Department of Commerce will be used to expand and modernize the corresponding division of the company, as well as the production of silicon components for equipment used in this area. This research center also specializes in pharmacology and biology. With its help, HP hopes to create components for the next generation of scientific equipment. The academic institutions with which HP collaborates should also benefit from HP’s provision of these funds.
Company CEO Enrique Lores said he hopes government subsidies will help HP invest more in microfluidics technology. As Reuters notes, the US authorities have already allocated more than $32 billion in subsidies under the “CHIP Law,” as well as about $29 billion in concessional loans. The previously mentioned subsidy amounts are preliminary in nature and may change depending on the results of the audit of applicants’ applications submitted by them to the US Department of Commerce.
Microsoft has officially confirmed changes to the Windows 11 Start menu regarding the All apps…
There is an opinion among experts that the new topological quantum processor Microsoft Majorana 1…
Some Chrome users have noticed that the uBlock Origin extension no longer works. The developers…
The directness of the current US President Donald Trump sometimes creates inconvenience for his partners,…
German retail, by the will of fate, found itself at the epicenter of a scandal…
Apple has officially confirmed that its generative AI platform, Apple Intelligence, will be coming to…