Copper mixed with diamonds will provide better cooling for the hottest chips

The growing energy consumption of data processing centers (DPCs) exacerbates the problem of heat removal from chips and components, since, according to statistics, over 50% of equipment failures are associated with overheating. This problem needs to be addressed at all levels of computing architecture, but it all starts with simple heatsinks. Everything else will largely depend on the properties of the heat-removing plate. The solution was proposed by a synthetic diamond manufacturer, Element Six (E6).

Image source: Element Six

For the Photonics West 2025 exhibition, which will be held in San Francisco from January 25 to 30, Element Six (E6) has prepared samples of a composite material made from copper and synthetic diamonds. This material has thermal conductivity two to three times higher than that of pure copper. The ratio of copper to diamond can be adjusted to suit customer requirements to achieve the optimal balance of performance. Some options will be available at the exhibition, as well as in the technical documentation provided.

The thermal conductivity of the composite material is in the range of 800–1000 W/mK (for comparison, the thermal conductivity of copper is 319.5 W/mK). In addition, the material has a relatively low coefficient of thermal expansion, which also varies depending on the ratio of copper and diamonds in the composite. Heatsinks can be manufactured in various shapes and sizes, with the possibility of applying gold or nickel coatings to the contact pads, which is necessary for certain connection processes with chip or die packages.

X-ray view – smooth mesh of synthetic diamonds