Budget Ryzen 5 7400f is warming as a 16-year-old-AMD saved on an internal thermal interface

Last month, AMD introduced the Six -core processor Ryzen 5 7400f. A chip worth about $ 115 appeared on sale in the Chinese market and was in the hands of the first observers. The latter found out that the novelty has a very unpleasant feature. Instead of the solder (Solder Thermal Interface Material, STIM), under its heat distribution cover is ordinary thermal paste. Because of this, even within the framework of its nominal TDP, the processor rests against the temperature limit.

Image source: Bilibili

Ryzen 5 7400F is almost completely identical to the Ryzen 5 7500F model. The younger model differs only by 300 MHz reduced by the maximum clock frequency, which is 4.7 GHz. Like the senior fellow, Ryzen 5 7400F has 32 MB Kesh-Mamaty L3. Its declared nominal TDP is 65 watts, and the energy consumption limit is 88 watts.

One of the Chinese observers was tested by Ryzen 5 7400f in pairs with RAM DDR5-6000 CL36 on the MSI MSI 850 Edge Ti WiFi maternal board. Two liquid cooling systems were used to cool the processor: Taiyu T360 Pro and DeepCool LP360. All the processor settings were standard, with the exception of the AMD Expo overclock profile for RAM. With this configuration, the Ryzen 5 7400F was 6 % slower than the Ryzen 5 7500F model in a single -to -use Cinebench R23 synthetic test.

But with the standard PPT 88 W, the maximum processor temperature was 95 degrees Celsius, even taking into account the use of SIO. Obviously, this is a direct consequence of using a less effective thermal paste instead of the solder between the processor and its crystals. With an increase in the heat packet power limit to 100 W, the maximum chip temperature increased to 105 degrees Celsius, which, of course, led to its rapid failure. After manual voltage and frequency adjustment in the BIOS Ryzen 5 7400F, he was able to accelerate to 5.05 GHz at a temperature of 96 degrees Celsius.

The observer did not test Ryzen 5 7400f in PBO mode, since this, apparently, does not make any sense. The solder between the heat distribution cover of the processor and its crystals has several advantages over ordinary thermal package. The point is not only in a more effective transfer of heat between these elements, but also in the durability of the thermal interface.

The average user who does not have time and desire to engage in acceleration, this information is unlikely to be interested. However, it is better to pay attention to the Ryzen 5 7500F with a more effective internal thermal interface to enthusiasts and even gamers, constrained in financial resources, but who want to get maximum from the processor.