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At the end of the first month of the third quarter, many companies rushed to sum up the results of the previous quarter, Samsung Electronics was among them. While preliminary…
Micron introduced 276-layer 3D TLC NAND flash memory chips of the ninth generation (Micron G9 NAND), as well as a series of Micron 2650 PCIe 4.0 solid-state drives based on…
G.Skill introduced dual-channel sets of high-speed Trident Z5 Royal Neo RAM modules with low latency. The new products stand out with support for AMD EXPO overclocking profiles, which make it…
SK hynix announced that by the end of the current quarter it will launch mass production of the new generation of GDDR7 graphics memory. The company was developing new memory…
The topic of Samsung products complying with Nvidia’s requirements for memory chips of the HBM3 and HBM3E types is not leaving the news feeds, and new data suggests that the…
Next year, the second part of SK hynix’s deal to buy Intel’s solid-state memory business, which was primarily built around a 3D NAND plant in Dalian, China, is due to…
Colorful has introduced a series of iGame Jiachen Zhilong DDR5 RAM modules, created in the same style as previously released Dragon Year limited edition motherboards. This high-performance memory is aimed…
TeamGroup has released a new series of T-Force GC PRO NVMe solid-state drives of the PCIe 5.0 standard. The manufacturer asks not to confuse the new products with the flagship…
Back in 2019, SK hynix intended to begin developing a production cluster in Yongin, but the pandemic prevented the corresponding plans, and it returned to the idea of developing this…
It is no secret that the South Korean company SK hynix is the leader in the HBM memory market, controlling approximately half of the segment and overtaking the nominally larger…