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Sabrent is preparing to release a high-speed external solid-state drive Rocket XTRM5 with support for the Thunderbolt 5 interface. The new product will provide sequential read speeds above 6 GB/s.…
As the battle for leadership in the HBM space intensifies, competition in the NAND market also intensifies. SK hynix has begun developing 400-layer NAND flash memory to provide higher storage…
Conditional concessions for US allies regarding the ability to supply chip production equipment to China should not mislead ordinary people. As Bloomberg notes, American authorities intend to limit Chinese companies’…
At the end of the first month of the third quarter, many companies rushed to sum up the results of the previous quarter, Samsung Electronics was among them. While preliminary…
Micron introduced 276-layer 3D TLC NAND flash memory chips of the ninth generation (Micron G9 NAND), as well as a series of Micron 2650 PCIe 4.0 solid-state drives based on…
G.Skill introduced dual-channel sets of high-speed Trident Z5 Royal Neo RAM modules with low latency. The new products stand out with support for AMD EXPO overclocking profiles, which make it…
SK hynix announced that by the end of the current quarter it will launch mass production of the new generation of GDDR7 graphics memory. The company was developing new memory…
The topic of Samsung products complying with Nvidia’s requirements for memory chips of the HBM3 and HBM3E types is not leaving the news feeds, and new data suggests that the…
Next year, the second part of SK hynix’s deal to buy Intel’s solid-state memory business, which was primarily built around a 3D NAND plant in Dalian, China, is due to…
Colorful has introduced a series of iGame Jiachen Zhilong DDR5 RAM modules, created in the same style as previously released Dragon Year limited edition motherboards. This high-performance memory is aimed…