RAM modules, memory cards, flash drives, card readers

G.Skill Introduces Improved DDR5 R-DIMM Memory with 16-Layer PCBs and Surge Protection

G.Skill has introduced enhanced DDR5 R-DIMM memory modules for workstations and server systems that comply with the latest version of…

1 month ago

Kioxia Introduces World’s First 332-Layer 3D NAND Memory, But Doesn’t Show It to Anyone

Kioxia, in partnership with SanDisk, has introduced 10th-generation 3D NAND (BiSC 10), the world's first 332-layer flash memory. It will…

1 month ago

Micron 4600 Consumer SSD Introduced – Up to 4TB and 14,500MB/s

Micron has introduced the Micron 4600 series of solid-state drives with PCIe 5.0 interface support. It includes models with a…

1 month ago

Nvidia and partners to create ultra-fast SOCAMM memory module for AI PC

Nvidia, together with leading manufacturers SK Hynix, Samsung and Micron, is developing a new memory standard aimed at high performance…

1 month ago

Nvidia AI Chips to Get Micron’s 12-Tier HBM3E Memory Stacks — Samsung Still Lagging

While Samsung Electronics is struggling to supply Nvidia with advanced HBM3E memory, American Micron Technology's success in this area allows…

1 month ago

SanDisk to Release SSD with Speeds Up to 14,500 MB/s and Power Consumption of Just 7 W

In its latest financial report, SanDisk announced two new SSD platforms. They don't have official names yet, but the manufacturer…

1 month ago

AI accelerators will get terabytes of memory: SanDisk plans to replace HBM with ultra-fast HBF flash memory

SanDisk will soon become independent from Western Digital, and it has big plans for the future. In particular, the company…

1 month ago

Samsung to Launch 286-Layer NAND Production in China to Keep Up with Local YMTC

All the activity of the previous three years, aimed at restricting the access of Chinese memory manufacturers to advanced production…

1 month ago

G.Skill introduced DDR5 modules at 16 and 48 GB with low delays and increased frequency

G.Skill introduced new two -channel DDR5 RAM sets. One of them offers a volume of 32 GB (2 × 16…

2 months ago

Finns will teach 3D nand manufacturers to produce record density chips

Researchers from the University of Linköping University received a patent for the technology of improved metalling holes in the production…

2 months ago