In May 2018, the American company Micron Technology began repurchasing its own shares, but by December 2022, market conditions forced…
The latest HBM3E memory from Samsung Electronics could not get into Nvidia's supply chains for a long time because it…
Among the foreign applicants for funds under the “CHIP Act” in the United States at one point was the South…
Samsung has announced the launch of mass production of the world's thinnest LPDDR5X memory modules with capacities of 12 and…
According to rumors, US authorities intend to take the next step to limit the access of Chinese developers of artificial…
Sabrent is preparing to release a high-speed external solid-state drive Rocket XTRM5 with support for the Thunderbolt 5 interface. The…
As the battle for leadership in the HBM space intensifies, competition in the NAND market also intensifies. SK hynix has…
Conditional concessions for US allies regarding the ability to supply chip production equipment to China should not mislead ordinary people.…
At the end of the first month of the third quarter, many companies rushed to sum up the results of…
Micron introduced 276-layer 3D TLC NAND flash memory chips of the ninth generation (Micron G9 NAND), as well as a…