Category: Development and manufacture of electronics

Modern processors are typically small in size, but the world’s largest contract semiconductor manufacturer TSMC is developing a new version of its CoWoS chip packaging technology that will enable the…

Qualcomm and Arm are set to meet in court again. Qualcomm’s lawsuit alleges breach of licensing agreement, squeezing out the mobile processor market, attempting to undermine customer relationships, and secretly…

In the text of the annual report, public companies usually assess the risks that can significantly affect their business, Taiwan’s TSMC was no exception. According to it, its own scale…

Huawei Technologies plans to begin mass shipping of its advanced Ascend 910C AI accelerator to Chinese customers as early as next month. Individual shipments of the chips have already taken…

Intel outlined the benefits of its 18-angstrom Intel 18A process node over the current 3-nanometer Intel 3 node ahead of the VLSI 2025 Symposium. Intel 18A is the company’s first…

TSMC has shared its plans for chip production in the United States. In particular, the Taiwanese manufacturer intends to produce 30% of its products in America using 2 nm and…

Despite the tightening of export controls by the United States, foreign components have been found in Huawei’s new Ascend 910C AI accelerators. Although the company claims to have developed the…

Japanese company TDK has demonstrated a “breakthrough” optical data transmission technology with a response time of 20 picoseconds. The “spin photodetector,” which combines optical, electronic, and magnetic elements, will replace…

Former Intel CEO Pat Gelsinger has become chairman of xLight, a company that plans to use the free-electron laser (FEL) as a light source for EUV lithography equipment. Image source:…