The largest memory manufacturer, Samsung Electronics, is hopelessly behind its two competitors in the HBM3E segment in terms of certification of its products to Nvidia requirements. A new wave of rumors allows us to hope that Samsung products will undergo the long-awaited certification by early June.

Image Source: Samsung Electronics

It was previously reported that Samsung’s 8-tier HBM3E stacks had passed Nvidia’s certification procedure back in December, but they could only be used on the latter brand’s accelerators for the Chinese market, and they would not make it to the Western market. The certification of Samsung’s 12-tier HBM3E stacks was next in line, since competitor Micron Technology was ready to start supplying similar memory for Nvidia’s needs in the coming months, and SK hynix was already supplying them.

According to the South Korean resource Alpha Economy, after a recent visit by Nvidia representatives to one of Samsung’s enterprises in South Korea, the HBM3E certification process is moving toward its logical conclusion. At least, Nvidia inspectors are satisfied with the results of the work done by Samsung specialists to improve the HBM3E memory chips of this brand.

The South Korean giant now plans to receive final approval for its supply for Nvidia’s needs by the end of May or the beginning of June of this year. Incidentally, SK hynix will provide Nvidia with samples of its 16-tier HBM3E memory this half of the year, so Samsung still has a lot of lost time to catch up on.

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