Nvidia may entrust Intel with packaging chips for advanced AI accelerators

At Intel’s last quarterly earnings call, the company’s other problems came to the fore, but prior to that, management regularly made it clear that the company was ready to package chips for orders from third-party customers. Taiwanese media are now reporting that, given the shortage of TSMC’s specialized capacities, Nvidia is eyeing the possibility of cooperation with Intel.

Image source: NVIDIA

In May last year, we recall, Nvidia founder Jensen Huang praised Intel’s modern technological processes, and conversations about the possibility of cooperation between the companies began a year before. However, new rumors indicate Nvidia’s interest in Intel’s services specifically in the field of chip packaging using advanced methods. TSMC has a monopoly on the use of CoWoS packaging, which is needed to release current generations of Nvidia computing accelerators, but technologically this method is very close to those used by Intel. Accordingly, sources believe that after some adaptation, Intel could begin packaging and testing Nvidia chips for computing accelerators.

In general, Qualcomm, Microsoft, Cisco and AWS (Amazon) are showing interest in such Intel services. Intel representatives have repeatedly said that in this area, contracts with customers begin to generate revenue much faster than in the area of ​​silicon wafer processing, so the processor giant is very interested in developing this area of ​​business. According to rumors, Intel has already received an order from Microsoft for the production of chips using Intel 18A technology worth $15 billion.