SK hynix announced that by the end of the current quarter it will launch mass production of the new generation of GDDR7 graphics memory. The company was developing new memory amid growing demand for components for AI systems from customers around the world.
Image source: skhynix.com
The first GDDR7 chips from SK hynix will offer an operating speed of 32 Gbps per pin, which is 60% faster than the previous generation of GDDR6 memory. In the future, the company plans to achieve speed increases of up to 40 Gbps from GDDR7 chips. The memory subsystems of high-performance video cards on the new chips will be able to provide a total bandwidth of more than 1.5 TB/s.
The energy efficiency of the new generation of memory has increased by more than 50%, the manufacturer claims – this was achieved thanks to new packaging technology, which helped solve the heating problem during fast data processing. The number of layers of heat-dissipating substrates has been increased from four to six, and the epoxy molding compound (EMC) in the package helps reduce thermal resistance by 74% compared to the previous generation—without changing the chip’s dimensions, making it easier to implement.
Head of DRAM product planning and implementation department at SK hynix Sangkwon Lee said GDDR7 will be used in a wide range of equipment, including 3D graphics, AI, high-performance computing and autonomous driving. “We will continue to strengthen our position as the most trusted AI memory solution provider by strengthening our premium memory portfolio,” said Mr. Lee.