Micron Technology has announced the start of distribution of samples of DDR5 MRDIMM (Multiplexed Rank Dual Inline Memory Module) memory modules, specifically designed for AI and HPC applications. Compared to conventional RDIMMs, MRDIMMs offer up to 39% higher memory bandwidth, 15% higher bus efficiency, and up to 40% lower latency. MRDIMM modules will have capacities of 32, 64, 96, 128 and 256 GB.
The memory modules provide a data transfer rate of 8800 MT/s and are available in two formats: standard and extended (TFF, Tall Form Factor) heights, which are suitable for 1U and 2U servers. Improved TFF module design reduces DRAM temperatures by up to 20°C at the same power and airflow, providing more efficient cooling in the data center and optimizing overall system power consumption for memory-intensive workloads.
Image source: Micron Technology
The new offering is said to be the first generation of the Micron MRDIMM family and will only be compatible with Intel Xeon 6 processors, as the JEDEC standard for MRDIMM memory has not yet been officially released. Bulk deliveries of Micron MRDIMM will begin in the second half of 2024. The company said that future generations of MRDIMMs will continue to provide up to 45% better memory bandwidth per channel compared to similar generation RDIMMs.
Previously, ADATA showed samples of MRDIMM (or MR-DIMM). And SK hynix, together with Intel and Renesas, announced at the end of 2022 the creation of a similar type of memory – DDR5 MCR (Multiplexer Combined Ranks) DIMM. This spring, Micron also showed samples of DDR5-8800 MCR DIMMs.